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  varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mle varistor series surface mount multilayer varistors (mlvs) > mle series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mle.html for current information. mle series mle varistor series rohs description the mle series family of transient voltage suppression de vices are based on the littelfuse multilayer fabrication technology. these components are designed to suppress esd events, including those speci?ed in iec 61000-4-2 or other standards used for electromagnetic compliance testing. the mle series is typically applied to protect integrated circuits and other components at the circuit board level operating at 18v dc , or less. the fabrication method and materials of these devices result in capacitance characteristics suitable for high frequency attenuation/low-pass ?lter circuit functions, thereby providing suppression and ?ltering in a single device. the mle series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. the mle series is compatible with modern re?ow and wave soldering procedures. littelfuse inc. manufactures other multilayer series products. see the ml series data sheet for higher energy/ peak current transient applications. see the auml series for automotive applications and the mln quad array. for highCspeed applications see the mhs series. features t 3p)4$pnqmjbou t 3bufegps&4% (iec-61000-4-2) t $ibsbdufsj[fegps impedance and capacitance t ?$up ?$ operating temp. range t -fbemftt    boetj[ft t 0qfsbujohwpmubhft up to 18v m(dc) t .vmujmbzfsdfsbnjd construction technology applications t 1spufdujpopg components and circuits sensitiv e to esd transients occurring on power supplies, control and signal lines t 4vqqsfttjpopg esd events such as speci?ed in iec-61000-4-2 or .*-45%$ .fuipe gps electromagnetic compliance (emc) t 6tfejonpcjmf communications, dpnqvufs&%1 products, medical products, hand held/ portable devices, industrial equipment, including diagnostic port protection and *0joufsgbdft absolute maximum ratings size table metric eia  0402 1 608  2012   1206 t'pssbujohtpgjoejwjevbmnfncfstpgbtfsjft tffefwjdfsbujohtboetqfdjmdbujpotubcmf continuous mle series units steady state applied voltage: %$7pmubhf3bohf 7 m(dc) ) 18 v 0qfsbujoh"ncjfou5fnqfsbuvsf3bohf 5 a ) up  ?$ 4upsbhf5fnqfsbuvsf3bohf 5 stg ) up  c
varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mle varistor series surface mount multilayer varistors (mlvs) > mle series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mle.html for current information. device ratings and speci?cations part number max continuous working voltage -55oc to 125oc performance speci?cations (25oc) nominal voltage maximum clamping voltage at speci?ed current (8/20 s) maximum esd clamp voltage (note 2) typical capacitance at 1mhz (note 1) v m(dc) v /0. at 1ma dc v c 8kv contact /puf
15kv air (note 4) (v) min (v) max (v) (v) (v) clamp (v) (pf) v18mle0402n 18 22 28 bu"  <110  7.-&/ 18 22 28 bu"  <110  7.-&-/ 18 22 28 bu" <100 <140 <100 7.-&/ 18 22 28 bu"    7.-&-/ 18 22 28 bu"   <100 v18mle1206n 18 22 28 bu"    'psbqqmjdbujpotfydffejoh?$bncjfouufnqfsbuvsf uif peak surge current and energy ratings must be reduced as shown below. peak current and energy derating curve nominal voltage stability to multiple esd impulses (8kv contact discharges per iec 61000-4-2) 0.1 frequency (mhz) impedance (z) 10 100 1000 10000 1 10 100 0.01 -0402 -0603 -0805 -1206 standby current at normalized varistor voltage and temperature impedance (z) vs frequency typical characteristic /05&4 1. for applications of 18v dc psmftt)jhifswpmubhftbwbjmbcmf dpoubduzpvs-juufmgvtf4bmft3fqsftfoubujwf 2. tested with iec-61000-4-2 human body model (hbm) discharge test circuit. %jsfduejtdibshfupefwjdfufsnjobmt *&$qsfgfssfeuftunfuipe
 4. corona discharge through air (represents actual esd event). $bqbdjubodfnbzcfdvtupnj[fe dpoubduzpvs-juufmgvtf4bmft3fqsftfoubujwf 6. leakage current ratings are at 18 v dc boea maximum. 25 0 1 current (a) nominal voltage at 1madc 10 100 1000 10000 5 10 15 20 30 1. 2 0.0 0.0001 25 0.001 0.01 0.1 1 current (ma) normalized varistor voltage (v) 1. 0 0.8 0.6 0.4 0.2 85 125 o o o 100 80 60 40 20 0 -55 50 60 70 80 90 100 110 120 130 140 150 percent of rated value ambient temperature ( o c) figure 1 figure 2 figure 3 figure 4
varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mle varistor series surface mount multilayer varistors (mlvs) > mle series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mle.html for current information. mle series 100 10 20 v26mla1206 40 60 80 100 120 140 temperature ( o c) clamping voltage (v) v5.5mla1206 0-20-40-60 device characteristics at low current levels, the v-i curve of the multilayer transient v oltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. at or below the maximum working voltage, the suppressor is in a high resistance model (approaching 10 6 at its maximum rated working voltage). leakage currents at maximum rated voltage are below 100 " uzqjdbmmza; gpstj[fcfmpx " uzqjdbmmza. 100% 1e -9 1e -8 suppressor current (a dc ) 10% 1e -7 1e -6 1e -5 1e -4 1e -3 1e -2 25 50 75 100 125 o c suppressor voltage in percent of v nom value at 25 o c (%) o oo o clamping voltage over temperature (v c at 10a) typical temperature dependance of the haracteristic $vswfjouif-fblbhf3fhjpo speed of response the multilayer suppressor is a leadless device. its response time is not limited b y the parasitic lead inductances found in other surface mount packages. the response time of the z n 0ejfmfdusjdnbufsjbmjtmftt than 1ns and the mle can clamp very fast dv/dt events such as esd. additionally, in "real world" applications, the associated circuit wiring is often the greatest factor effecting speed of response. therefore, transient suppressor placement within a circuit can be considered important in certain instances. grains depletion fired ceramic dielectric region metal electrodes depletion region metal end termination multilayer internal construction energy absorption/peak current capability energy dissipated within the mle is calculated by multiplying the clamping v oltage, transient current and transient duration. an important advantage of the multilayer is its interdigitated electrode construction within the mass of dielectric material. this results in excellent current distribution and the peak temperature per energy absorbed is very low. the matrix of semiconducting grains combine to absorb and distribute transient energy (heat) tff4qffepg3ftqpotf
5ijtesbnbujdbmmzsfevdftqfbl temperature; thermal stresses and enhances device reliability. as a measure of the device capability in energy and peak current handling, the v26mla1206a part was tested with nvmujqmfqvmtftbujutqfbldvssfousbujoh "  s). at the end of the test, 10,000 pulses later, the device voltage characteristics are still well within speci?cation. 100 10 0 v26mla1206 2000 4000 6000 8000 10000 12000 number of pulses vo ltag e peak current = 150a 8/20 s duration, 30s between pulses 3fqfujujwf1vmtf$bqbcjmjuz figure 5 figure 6 figure 7 figure 8
varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mle varistor series surface mount multilayer varistors (mlvs) > mle series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mle.html for current information. lead (pb) soldering recommendations the principal techniques used for the soldering of dpnqpofoutjotvsg bdfnpvouufdiopmphzbsf*33fnpx and wave soldering. typical pro?les are shown on the right. the recommended solder for the mle suppressor is b 4o1c"h
 4o1c
ps 4o1c
 -juufmgvtfbmtpsfdpnnfoetbo3."tpmefsnvy wave soldering is the most strenuous of the processes. to avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. when using a re?ow process, care should be taken to ensure that the mle chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. during the soldering process, preheating to within 100 degrees of the solder's qfblufnqfsbuvsfjtfttfoujbmupnjojnj[fuifsnbmtipdl 0odfuiftpmefsjohqspdfttibtcffodpnqmfufe jujt still necessary to ensure that any further thermal shocks bsfbwpjefe0ofqpttjcmfdbvtfpguifsnbmtipdljtipu printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. the boards must be allowed to cool gradually upmfttuibo?$cfgpsfdmfbojoh 5.0 6.0 7.0 maximum temperature 260?c 20 - 40 seconds within 5?c preheat zone ramp rate <3?c/s 60 - 150 sec > 217?c leadCfree (pb-free) soldering recommendations littelfuse offers the nickel barrier termination ?nish for the optimum l eadCfree solder performance. 5ifqsfgfssfetpmefsjt 4o"h$v
xjuibo3." ?ux, but there is a wide selection of pastes and ?uxes available with which the nickel barrier parts should be compatible. the re?ow pro?le must be constrained by the maximums jouif-fbeogsff3fnpx1spmmf'ps-fbeogsff8bwf tpmefsjoh uif8bwf4pmefs1spmmftujmmbqqmjft /pufuif-fbeogsffqbtuf nvyboeqspmmfxfsfvtfegps evaluation purposes by littelfuse, based upon industry standards and practices. there are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. 230 re?ow solder pro?le wave solder pro?le leadCfree re-?ow pro?le figure 9 figure 10 figure 11
varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mle varistor series surface mount multilayer varistors (mlvs) > mle series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mle.html for current information. mle series product dimensions (mm) /puf"wpjenfubmsvotjouijtbsfb qbsutbsf not recommended for use in applications using silver (ag) epoxy paste. dimension 1206 size 0805 size 0603 size 0402 size in mm in mm in mm in mm a 0.1 60 4.06 0.120  0.100    b       0.020  c 0.040 1.02 0.040 1.02  0.89 0.024 0.61 d (max.)  1.80  1.10 0.040 1.00 0.024 0.60 e           0.008     0.006   l   0.012     0.008     0.006     0.004   w       0.008     0.006     0.004   c b a note: avoid metal runs in this area. note d e w l 1"%-":065%&.&/4*0/4 $)*1-":065%*.&/4*0/4 part numbering system v 18 1206 packing options (see packaging section for quantities) device size: i.e., 120 mil x 60 mil device family littelfuse tvss device x maximum dc working voltage mle x x capacitance option no letter: standard l: low capacitance version end termination option multilayer series designator (3mm x 1.5mm) n: nickel barrier (ni/sn) t: 13in (330mm) diameter reel, plastic carrier tape h: 7in (178mm) diameter reel, plastic carrier tape r: 7in (178mm) diameter reel, paper carrier tape packaging* device size quantity 13 inch reel ('t' option) 7 inch reel ('h' option) 7 inch reel ('r' option) bulk pack ('a' option) 1206 10,000    n/a   10,000   n/a   10,000   4,000  0402 n/a n/a 10,000 n/a 1bdlbhjoh
*ujtsfdpnnfoefeuibuqbsutcflfqujouiftfbmfecbhqspwjefeboeuibuqbsutcfvtfebttppobtqpttjcmfxifosfnpwfegspncbht
varistor products ?2011 littelfuse, inc. revision: november 29, 2011 mle varistor series surface mount multilayer varistors (mlvs) > mle series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/mle.html for current information. tape and reel speci?cations symbol description dimensions in millimeters 0402 size 0603, 0805 & 1206 sizes a 0 width of cavity %fqfoefoupo$ijq4j[fup.jojnj[f3pubujpo b 0 length of cavity %fqfoefoupo$ijq4j[fup.jojnj[f3pubujpo k 0 depth of cavity %fqfoefoupo$ijq4j[fup.jojnj[f3pubujpo w width of tape     f distance between drive hole centers and cavity centers     e distance between drive hole centers and tape edge     p 1 distance between cavity centers     p 2 axial drive distance between drive hole centers & cavity centers     p 0 axial drive distance between drive hole centers     d 0 drive hole diameter     d 1 %jbnfufspg$bwjuz1jfsdjoh n/a   t 1 top tape thickness 0.1 max 0.1 max /puft t$pogpsntup&*" 3fwjtjpo" t$bocftvqqmjfeup*&$qvcmjdbujpo k 0 t 1 d 0 p 0 d 1 p 1 a 0 p 2 b 0 f e w for t and h pack options: plastic carrier tape for r pack options: embossed paper carrier tape embossment top tape 8mm nominal product identifying label 178mm or 330mm dia. reel


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